According to Projection Times, Jiangsu Tianjing Intelligent Equipment Co., Ltd. (hereinafter referred to as "Tianjing Intelligent Equipment") announced that its independently developed 12-inch sapphire substrates and carrier wafers have simultaneously achieved mass production, with an annual capacity of 100,000 pieces and a yield rate exceeding 97%.
The 12-inch sapphire substrates currently in mass production feature a diameter control precision of 300±0.5mm, a surface roughness of 0.2 nanometers, and a dislocation density of ≤500 cm⁻², capable of withstanding high temperatures of 2050℃. These specifications meet the manufacturing requirements for high-end devices such as GaN epitaxy and Micro LEDs.
By utilizing an original ultra-high-speed diamond wire cutting technology (wire speed 3000 meters/minute) and magnetron sputtering process, the 12-inch sapphire substrates achieve an 80% reduction in dislocation density in the epitaxial layer, thereby improving the luminous efficiency of LED chips.
According to available data, Tianjing Intelligent Equipment was founded in Shenzhen in 2015, focusing on intelligent equipment from the outset. In 2019, the company established its production headquarters in Xuzhou. In 2024, to expand its scale, the factory relocated to Huai'an, and a branch company was established in Shuitou Town, Fujian Province, completing its national strategic layout.
